Wirebond Process Engineering Lead

Role Overview

The Wirebond Process Engineering Lead will spearhead technical and managerial efforts for comprehensive integrated circuit (IC) packaging process development, ensuring readiness for large-scale manufacturing and driving ongoing improvements in wirebond and flip chip technologies. This position is responsible for achieving process yield, reliability, cost efficiency, scalability, and executing technology roadmaps while collaborating closely with teams across new product introduction (NPI), technology development (TD), equipment, quality, and customers.

Key Responsibilities

• Manage the full spectrum of process integration, including wafer and die preparation, die attach methods, wire bonding techniques, underfill, cleaning, encapsulation, plating, soldering, and final package separation and inspection.
• Establish and maintain control plans, process windows, and critical-to-quality (CTQ) metrics across all packaging product lines.
• Lead technology qualification processes, advancing development efforts to volume manufacturing scales, and driving alignment of technology roadmaps with customer, market, and packaging demands.
• Oversee readiness for engineering validation test (EVT), design validation test (DVT), and production validation test (PVT) from a process viewpoint.
• Collaborate with cross-functional teams (NPI, product engineering, TD) to ensure design for manufacturability (DFM) and design for reliability (DFR).
• Ensure seamless transfer of technology from development to production phases.
• Monitor ramp-up metrics including yield learning, cycle times, and waste reduction.
• Accountable for first pass yield, final yield, and field reliability targets, leading root cause analyses on yield deviations via statistical process control (SPC), failure mode and effects analysis (FMEA), design of experiments (DOE), and failure analysis tools.
• Manage JEDEC reliability qualification processes and partner with Quality to address returns, audits, and escalations.
• Provide technical guidance in equipment procurement, approval, and productivity enhancements; support capital expenditure (CAPEX) evaluation and ROI justification.
• Drive cost of ownership reductions, productivity improvements, overall equipment effectiveness (OEE), cycle time improvements, and line balancing projects.
• Lead automation, digital transformation, and smart manufacturing initiatives, assisting with factory expansions and greenfield/brownfield developments.
• Develop and lead a skilled process engineering team including subject matter experts (SMEs), providing mentorship, competency development, training, and succession planning.
• Promote a culture grounded in technical excellence, accountability, continuous improvement, and adherence to company values.
• Serve as a technical expert representing process engineering in customer engagement, executive meetings, technology discussions, risk mitigation, and business development support including technology feasibility and cost modeling.

Qualifications and Experience

• Bachelor’s or Master’s degree in relevant Engineering disciplines, preferably Mechanical or Electronics Engineering.
• 5-7 years of experience in the OSAT (Outsourced Semiconductor Assembly and Test) industry holding a similar leadership role.
• Extensive overall experience of 15-20 years in semiconductor IC packaging and assembly.
• Proven track record of success managing high-volume, multi-package/device manufacturing environments, with demonstrated improvements in yield, reliability qualifications, and cost reductions.

Key Performance Indicators

• Yield and reliability performance
• Cost reduction and productivity enhancements
• Successful NPI cycle times and ramp-up achievements
• Customer satisfaction and audit completion
• Talent retention and organizational capability maturity