Principal Tape Out Engineer

Role Overview

The Principal Tape Out Engineer holds a vital position in the semiconductor product development cycle, acting as the final gatekeeper before designs proceed to fabrication. This role demands meticulous verification of design data against manufacturing criteria to assure quality and compliance.

Key Responsibilities

• Manage and implement the tape out process for semiconductor devices, ensuring that design data is submitted to manufacturing accurately and on schedule.
• Conduct thorough reviews of design databases and associated documentation to guarantee integrity and resolve any inconsistencies.
• Collaborate extensively with multidisciplinary teams including design engineers, technologists, program managers, and process engineers to address technical challenges and enhance manufacturability.
• Confirm that all tape out outputs meet the stringent requirements set by the fabrication foundry.
• Document tape out protocols, revisions, and results meticulously for reference and continuous process enhancements.

Qualifications

• Bachelor’s degree in Electrical Engineering, Computer Engineering, or a closely related discipline; a Master’s degree is preferred.
• Proficient with physical design software tools such as Cadence and Synopsys, along with a solid understanding of semiconductor manufacturing processes.
• Strong attention to detail and excellent problem-solving capabilities, with the ability to operate effectively under pressure and tight deadlines.
• Flexible to work varying hours when necessary to support critical tape out schedules.
• Proficient communication skills in English to facilitate collaboration among technical stakeholders.

Additional Information

This position suits candidates passionate about precision and innovation, eager to contribute to the successful deployment of advanced semiconductor technologies.