Principal Engineer - Process Integration in Semiconductor Technology

Introduction

A renowned global semiconductor foundry is seeking a Principal Engineer specializing in Process Integration to support its fabrication facility expansion. This role is crucial in advancing semiconductor devices through collaboration with diverse teams, optimizing manufacturing workflows, resolving integration challenges, and driving continuous enhancement efforts to meet project objectives.

Key Responsibilities

• Diagnose, troubleshoot, and improve process integration and yield-related challenges.
• Manage projects and perform comprehensive data analyses.
• Develop tailored or derivative manufacturing processes tailored to customer specifications.
• Assist new product designs by conducting module characterizations and formulating design rules.
• Collaborate with cross-functional teams to minimize defect occurrences and address technical and yield concerns.
• Create and refine test structures to facilitate expedited and thorough process characterization.
• Lead continuous improvement initiatives (CIP) aligned with organizational goals.
• Establish and maintain a defect source library and develop tools for defect source identification.
• Conduct product and process partitioning studies aimed at yield and defect assessment to drive quality enhancements.
• Ensure thorough documentation of processes, assess failure modes, and implement mitigation and detection strategies.
• Adhere strictly to safety, environmental, health, and security protocols throughout all activities.
• Participate and collaborate in other projects or assignments as needed.

Candidate Profile

• Possess a degree in Electrical Engineering, Chemical Engineering, Science, or a related engineering discipline.
• Bring at least 7 years of relevant experience in semiconductor process integration.
• Demonstrated expertise in semiconductor processes, particularly in BCD, RFSOI, or Silicon Photonics development.
• Strong capabilities in device characterization, process qualification, and integration troubleshooting.
• Knowledge of module development and semiconductor tooling is a beneficial asset.

Additional Information

Candidates are advised to prepare their updated resumes, including their current detailed salary breakdown (base salary, incentives, annual wage supplement, etc.) along with expected compensation figures. Only shortlisted applicants will be contacted for further process.