Engineering Director - Advanced Semiconductor Packaging

Role Overview

As Engineering Director, reporting directly to the Business Unit General Manager, you will provide leadership to diverse technical teams encompassing process, mechanical, electrical and controls, software, optics and metrology, as well as systems and laboratory operations. You will take ownership of system architecture, placing a focus on placement and overlay error budgets from initial concept through to a fully qualified tool deployed at customer sites.

Key Responsibilities

• Develop and implement alignment strategies including decisions on camera architecture, mark design rules, calibration, and closed-loop overlay correction.
• Oversee phase-gated development processes comprising design reviews, Failure Mode and Effects Analysis (FMEA), requirements traceability, and configuration management.
• Manage engineering budgets, timelines, risk assessments, and make strategic decisions on manufacturing versus purchasing.
• Coordinate with Applications, Quality, and Operations teams for tool qualification, compliance with SEMI S2/S8 standards, and smooth transfer into manufacturing.
• Define and maintain the technical roadmap aiming for finer pitches and tighter overlay tolerances, while also enhancing the business unit's intellectual property portfolio.
• Recruit, mentor, and nurture senior specialists in key technical domains including bond head, motion control, optics, vision systems, and equipment software development.

Candidate Profile

• Possess a Master’s or PhD degree in mechanical, electrical, mechatronics, optical engineering, or physics.
• Bring over 15 years of experience in semiconductor capital equipment, with more than 7 years in leadership roles managing multidisciplinary engineering teams.
• Have a proven track record of delivering at least one precision placement, bonding, lithography, or metrology tool from concept through to customer validation.
• Demonstrate specialized knowledge in sub-micron optical alignment and error budgeting.
• Understand precision motion control, thermal and vibration management, and machine vision technologies.
• Have practical insights into die placement and bonding techniques such as hybrid bonding, Thermocompression Bonding (TCB), and flip-chip.
• Show capability in attracting, developing, and retaining senior technical professionals.

Preferred Qualifications

• Hands-on experience with hybrid bonding, TCB, flip-chip bonders, or wafer-to-wafer aligners.
• Possess patents or scholarly articles in areas related to alignment optics, precision motion, or bonding technologies.
• Experience in tool qualification processes within foundries, Integrated Device Manufacturers (IDMs), or Outsourced Semiconductor Assembly and Test providers (OSATs).

Additional Information

Candidates interested in this role should forward their updated resumes in MS Word format to the designated consultant. Due to volume, only shortlisted applicants will be contacted. This is a full-time, onsite position based in Tampines, East Region, Singapore.