Application Director - Advanced Semiconductor Packaging

Overview

This leadership position reports directly to the Business Unit General Manager overseeing application development, process integration, field service, and customer engineering teams. The role focuses on translating customer semiconductor process requirements into precise tool specifications, defining test setups in collaboration with customers and engineering, and leading customer demonstrations and problem resolution.

Key Responsibilities

• Lead teams including applications, process integration, field service, and on-site customer engineers.
• Convert customer process criteria such as die size, pad pitch, overlay, throughput, and cleanliness into detailed tool specifications.
• Define test vehicles, alignment-mark requirements, and acceptance criteria jointly with customers and engineering departments.
• Conduct customer demos and evaluations; troubleshoot issues related to overlay, die shift, voids, and bond strength.
• Provide expert guidance to customers regarding mark design, layout, and process enhancements improving alignment and bond yield.
• Coordinate bonder integration with upstream and downstream processes including CMP, cleaning, plasma activation, annealing, and metrology.
• Lead tool installation and site acceptance processes; monitor uptime, Mean Time Between Failures (MTBF), and overlay stability, feeding critical field data back to Engineering and Quality teams.
• Develop and maintain field service procedures encompassing installation, escalation protocols, spare parts management, and training.
• Support sales activities through technical selling, benchmarking, and providing input on roadmaps.

Candidate Profile

• Holds a Master's or PhD degree in materials science, chemical, electrical, mechanical or optical engineering, or physics.
• Over 12 years of experience in semiconductor equipment applications, process, or field engineering, including at least 5 years in leadership roles managing customer-facing teams.
• Hands-on experience with advanced semiconductor packaging technologies such as hybrid bonding, Die-to-Wafer (D2W), Wafer-to-Wafer (W2W), Thermal Compression Bonding (TCB), or flip-chip.
• In-depth understanding of overlay data and alignment-mark performance at the process level.
• Proven track record leading new tool installations and acceptance tests at semiconductor fabs or OSATs (Outsourced Semiconductor Assembly and Test).
• Proficient in statistics of experimental design (DOE), statistical process control (SPC), gauge repeatability and reproducibility (R&R), and thorough defect and yield analysis.
• Ability to effectively engage and communicate with customer engineering leadership.

Additional Advantages

• Established relationships with advanced packaging teams within foundries, IDMs, or OSAT companies.
• Experience in creating field service organizations from the ground up.
• Familiarity with SEMI S2/S8 safety standards and semiconductor fab facility requirements.