Director, Advanced Packaging Disruptive Technology

About WhiteCrow Research and Our Client

WhiteCrow Research specializes in global talent insight, research, and talent pipelining with offices across multiple countries including Singapore. Our extensive international presence enables us to deeply understand and access specialized markets globally, complementing clients' internal research teams.

Our client is a world-leading company in materials engineering solutions that underpin nearly every emerging semiconductor and advanced display technology globally. Their innovations critically support AI advancement and the commercialization of next-generation chips. With a legacy spanning over 55 years, this organization has driven technological progress through pioneering innovations that positively affect billions worldwide. Their workforce comprises some of the brightest visionaries, engineers, and scientists who merge their diverse expertise to push forward material innovations defining the future of technology.

Role Overview and Responsibilities

• Develop and implement a long-term (N+2 and beyond) pathfinding strategy for advanced packaging, focusing on integration, interconnect, materials, and architectural innovation.
• Lead incubation and feasibility studies of disruptive packaging technologies beyond current platforms, including novel interconnect options, heterogeneous integration designs, and next-gen substrate innovations.
• Assess emerging technologies and steer make-or-buy-or-partner strategies to secure unique capabilities ahead of widespread industry adoption.
• Forecast and specify technological turning points aligned with AI, HPC, memory integration, chiplet ecosystems, and future system design.
• Assemble and motivate a world-class team dedicated to pathfinding and innovation, nurturing a bold culture that encourages experimentation and calculated risks.
• Instill an innovation-driven mindset within teams to challenge existing norms and pursue unconventional solutions.
• Implement structured processes for idea generation, rapid prototyping, and refinement to support innovation life cycles.
• Mentor technical leaders and cultivate a sustainable innovation talent pipeline for long-term competitive advantage.
• Convert customer roadmaps, systems architecture trends, and market shifts into robust technology development plans.
• Engage closely with key customers to uncover latent needs and challenges unaddressed by current packaging technologies.
• Drive innovation in creating new product concepts and technology platforms delivering significant improvements in performance, cost-efficiency, power consumption, and scalability.
• Position products to emphasize clear value differentiation and sustainable competitive edge.
• Develop and lead a collaborative innovation ecosystem involving suppliers, substrate manufacturers, OSATs, foundries, equipment partners, and research institutions.
• Identify and activate disruptive partnerships to speed innovation cycles and facilitate early-stage technology validation.
• Lead joint development initiatives and participate in consortia to influence industry standards and directions.
• Establish governance frameworks for early technology projects balancing open exploration with disciplined execution.
• Coordinate alignment among engineering, product, and business teams to move pathfinding concepts into concrete development pipelines.
• Create executive-level narratives and decision frameworks for communicating technology trade-offs, investments, and strategic priorities.
• Ensure continuous knowledge capture and dissemination of insights from early exploration for organizational leverage.

Leadership Expectations

• Serve as a visionary technology leader anticipating market disruptions and defining future architectures ahead of competitors.
• Act as an innovation catalyst fostering a culture where breakthrough ideas emerge, are tested, and scaled.
• Function as a strategic connector aligning customer needs, internal strengths, and ecosystem innovations into unified strategies.
• Build high-performing teams and champion a culture of collaboration and accountability.
• Exhibit decisive leadership capable of operating effectively amidst ambiguity and making impactful decisions with incomplete data.

Qualifications and Experience

• Over 15 years of professional experience in semiconductor technologies, specifically in advanced packaging, front-end processing, or related fields.
• Proven track record leading technology pathfinding, innovation strategy, or early-stage platform development.
• Strong expertise in current advanced packaging methods such as Die-to-Wafer (D2W), Redistribution Layer (RDL), Chip-on-Wafer-on-Substrate (CoWoS), Through Silicon Via (TSV), accompanied by visionary thinking beyond existing technologies.
• Experience in building and guiding cross-functional or exploratory research and development teams.
• Ability to effectively translate complex technological concepts into strategic business impacts and direction.