Associate Simulation Engineer - Thermal/CFD

About the Role

We are seeking an Associate Simulation Engineer specializing in thermal and computational fluid dynamics (CFD) to join our engineering team in Singapore. This position involves conducting CFD and thermal simulations focused on electronics cooling applications, involving airflow assessments, convection heat transfer, and conjugate heat transfer processes.

Key Responsibilities

• Conduct CFD and thermal analyses at component, board, enclosure, and sub-system levels for electronic devices.
• Efficiently create and execute simulation models to meet internal and customer technical requests.
• Set appropriate boundary conditions, material properties, and solver configurations under senior engineer supervision.
• Perform both steady-state and transient thermal analyses, simulating power ramp-ups, duty cycles, and fault scenarios.
• Analyze and interpret simulation outputs to detect thermal risks and airflow inefficiencies, suggesting design enhancements.
• Support correlation of simulation results with physical experiments, lab data, or field observations.
• Document clearly the assumptions, methodologies, findings, and any limitations in technical reports.
• Participate in verification and validation processes to ensure model accuracy and compliance with established standards.
• Collaborate with senior engineers to align with safety considerations, certification criteria, and modeling quality expectations.
• Learn and apply best practices regarding mesh generation, numerical stability, convergence checking, and credible results evaluation.
• Work collaboratively with cross-functional teams, contributing to a culture of knowledge sharing and support.

Candidate Profile and Qualifications

• Bachelor’s or Master’s degree in Mechanical Engineering, Thermal Sciences, Aerospace Engineering, or related fields from recognized institutions.
• 2 to 5 years of practical or industrial experience in CFD and thermal-fluid simulation, including internships or thesis work.
• Strong foundation in fluid mechanics, turbulence modeling, heat transfer methods (conduction, convection, radiation), and thermodynamics applied to electronics cooling.
• Hands-on experience setting up CFD models, running simulations, and interpreting results.
• Proficiency with commercial CFD software such as ANSYS Icepak, ANSYS Fluent, FLOTHERM, FLOEFD, STAR-CCM+, COMSOL, or equivalent.
• Understanding of mesh generation principles, solver configuration, convergence behavior, and adherence to systematic modeling procedures.
• Effective communication skills for clearly articulating technical results.
• Self-driven, detail-focused, and eager to learn in a technically demanding environment.
• Exposure to electronics thermal management elements like integrated circuits, PCBs, heat sinks, fans, and enclosures.
• Knowledge of electronics packaging constraints including spatial limits, airflow resistance, materials, and power dissipation.
• Basic experience with thermal testing methods including thermocouple placement and data acquisition.
• Familiarity with matching simulation outcomes to experimental or test data.
• Understanding of transient thermal behavior and power cycling dynamics.
• Interest in automation and AI-assisted simulation workflows.

About the Company

Our client is a global leader in applied safety sciences, delivering product testing, inspection, certification, software solutions, and advisory services worldwide. They serve more than 110 countries, helping customers innovate safely and responsibly while navigating complex regulations and supply chains. Their mark is a symbol of trust and commitment to safety advancement.