Wafer Fab Process Engineer

Job Summary

Take ownership of process development, enhancement, and transitioning to manufacturing to meet yield, quality, cost, and reliability goals.

Key Responsibilities

• Manage advanced process modules, including thin film deposition (metal/passivation), wafer thinning, and thermal processes like oxidation, diffusion, and implantation.
• Lead initiatives aimed at improving yield and minimizing defects through statistical analysis and Design of Experiments methods.
• Oversee new process integration and the transfer of processes into high-volume manufacturing environments.
• Conduct root cause investigations and apply effective corrective and preventive measures.
• Establish process control plans, implement Statistical Process Control strategies, and execute Operational Control Action Plans.
• Collaborate closely with equipment, integration, quality assurance, and research and development teams.
• Provide guidance and mentorship to junior engineers and technicians.
• Engage with suppliers to enhance processes and materials.

Qualifications

• Bachelor’s or Master’s degree in Engineering disciplines such as Electrical, Chemical, Materials, or related fields.
• A minimum of 5 years experience in semiconductor wafer fabrication focusing on thin film (metal/passivation) or thermal processes (oxidation, diffusion, implantation).
• Expertise in Statistical Process Control, Design of Experiments, Failure Mode and Effects Analysis, and statistical data analysis tools.
• Proven leadership abilities in managing cross-functional technical projects.
• Strong problem-solving, analytical thinking, and communication capabilities.

Preferred Qualifications

• Doctorate degree (PhD) in relevant Engineering fields.
• Certification in Six Sigma (Green or Black Belt).
• Experience supporting wafer size scaling from 4" to 6" or similar manufacturing transitions.